发明名称 |
PRINTED WIRING BOARD, POLYOLEFINIC RESIN COMPOSITION, AND METHOD FOR MANUFACTURING OF PRINTED WIRING BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board having layer insulation resin layers using a polyolefinic resin composition easy to form openings of desired shapes even when a laser beam is used. SOLUTION: The printed wiring board has conductor circuits and layer insulation resin layers stacked one above the other on a board, the conductor circuits being connected by vias, and the layer insulation resin layers are made of a polyolefinic resin composition containing organic fillers and a polyolefinic resin. |
申请公布号 |
JP2001094262(A) |
申请公布日期 |
2001.04.06 |
申请号 |
JP19990266931 |
申请日期 |
1999.09.21 |
申请人 |
IBIDEN CO LTD |
发明人 |
SHIMADA KENICHI;ASAI MOTOO;O TOUTO;SEKINE KOJI |
分类号 |
H05K3/46;C08L23/00;C08L27/12;C08L61/06;C08L61/28;C08L63/00;C08L71/12;C08L79/08;(IPC1-7):H05K3/46 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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