发明名称 PRINTED WIRING BOARD, POLYOLEFINIC RESIN COMPOSITION, AND METHOD FOR MANUFACTURING OF PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a printed wiring board having layer insulation resin layers using a polyolefinic resin composition easy to form openings of desired shapes even when a laser beam is used. SOLUTION: The printed wiring board has conductor circuits and layer insulation resin layers stacked one above the other on a board, the conductor circuits being connected by vias, and the layer insulation resin layers are made of a polyolefinic resin composition containing organic fillers and a polyolefinic resin.
申请公布号 JP2001094262(A) 申请公布日期 2001.04.06
申请号 JP19990266931 申请日期 1999.09.21
申请人 IBIDEN CO LTD 发明人 SHIMADA KENICHI;ASAI MOTOO;O TOUTO;SEKINE KOJI
分类号 H05K3/46;C08L23/00;C08L27/12;C08L61/06;C08L61/28;C08L63/00;C08L71/12;C08L79/08;(IPC1-7):H05K3/46 主分类号 H05K3/46
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