发明名称 LAMINATED CHIP INDUCTOR
摘要 PROBLEM TO BE SOLVED: To provide a laminated chip inductor which can be improved in yield and suitably mounted on a bulk-adaptive chip by surely preventing faults in conduction, without making large the diameter of through holes electrically connecting a coiled internal conductor and an external electrode. SOLUTION: This laminated chip inductor is equipped with a coiled internal conductor 11, formed of conductor patterns laminated in stages and an external terminal 12 which is electrically connected to an end part of the coiled internal conductor 11, and the coiled internal conductor 11 and external electrode 12 are connected electrically together via through holes 13.
申请公布号 JP2001093730(A) 申请公布日期 2001.04.06
申请号 JP19990266983 申请日期 1999.09.21
申请人 KOA CORP 发明人 ICHIKAWA MASABUMI;HAYASHI TAKUO
分类号 H01F17/00;H01F27/29;(IPC1-7):H01F17/00 主分类号 H01F17/00
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