发明名称 |
DIE AND METHOD FOR MOLDING SUBSTRATE FOR OPTICAL INFORMATION RECORDING MEDIUM |
摘要 |
PROBLEM TO BE SOLVED: To manufacture a thin optical disk substrate for causing no deterioration of signal quality and mechanical characteristics. SOLUTION: An inner peripheral part of the substrate 1 is peeled off from a mirror surface block 3 by pushing a protruding sleeve 5 out when a movable side die 2 reaches a position to take the substrate 1 out. A clamped region of the substrate 1 is peeled off from the block 3 by supplying air to an air supply slit 10 provided in the sleeve 5 when the sleeve 5 advances by the predetermined protrusion length and blowing the air from an air blowing port 101 at the tip of the sleeve 5 to the space between an inner peripheral side surface of the block 3 and the substrate 1. The whole surface of the substrate 1 is peeled off from the block 3 by supplying the air to an air supply slit 6 of the block 3 after the air is blown through the port 101 for a prescribed time and blowing the air through an air blowing port 61.
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申请公布号 |
JP2001093198(A) |
申请公布日期 |
2001.04.06 |
申请号 |
JP20000211136 |
申请日期 |
2000.07.12 |
申请人 |
RICOH CO LTD |
发明人 |
KOTAKA KAZUHIRO |
分类号 |
B29C33/46;G11B7/26;(IPC1-7):G11B7/26 |
主分类号 |
B29C33/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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