发明名称 DIE AND METHOD FOR MOLDING SUBSTRATE FOR OPTICAL INFORMATION RECORDING MEDIUM
摘要 PROBLEM TO BE SOLVED: To manufacture a thin optical disk substrate for causing no deterioration of signal quality and mechanical characteristics. SOLUTION: An inner peripheral part of the substrate 1 is peeled off from a mirror surface block 3 by pushing a protruding sleeve 5 out when a movable side die 2 reaches a position to take the substrate 1 out. A clamped region of the substrate 1 is peeled off from the block 3 by supplying air to an air supply slit 10 provided in the sleeve 5 when the sleeve 5 advances by the predetermined protrusion length and blowing the air from an air blowing port 101 at the tip of the sleeve 5 to the space between an inner peripheral side surface of the block 3 and the substrate 1. The whole surface of the substrate 1 is peeled off from the block 3 by supplying the air to an air supply slit 6 of the block 3 after the air is blown through the port 101 for a prescribed time and blowing the air through an air blowing port 61.
申请公布号 JP2001093198(A) 申请公布日期 2001.04.06
申请号 JP20000211136 申请日期 2000.07.12
申请人 RICOH CO LTD 发明人 KOTAKA KAZUHIRO
分类号 B29C33/46;G11B7/26;(IPC1-7):G11B7/26 主分类号 B29C33/46
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