| 摘要 |
PURPOSE: An apparatus for cleaning a wafer is provided to prevent remaining contaminant from being adhered to a wafer or from reducing cleaning efficiency in a subsequent process for cleaning the wafer, by effectively eliminating the contaminant remaining in a cleaning liquid or bath after a process for cleaning the wafer. CONSTITUTION: A chemical supplying/exhausting pipe(12) is formed in a bottom surface of a chemical bath(16). A chemical hole plate(11) is installed inside the chemical bath, and has filters in respective holes. A deionized(DI) water bath is installed in an outer portion of the chemical bath, and a DI water supplying pipe(13) is connected to the DI water bath. The DI water bath supplies DI water to the chemical bath through a DI water supplying hole(14).
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