发明名称 CHIP COMPONENT TYPE LIGHT EMITTING DIODE AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a light-emitting diode with stable shape of light emitting face and good light shielding and reflecting characteristics, by mounting a mounting substrate, in parallel with a light guiding plate without turning the substrate on its side. SOLUTION: A semi-circular through-hole is formed on a side face of a second substrate 43 mounted on a first substrate 42. An LED chip 44 is mounted in the through-hole on a pattern 46 of the first substrate 42 and connected to an electrode 45b with an Au wire 47 via a pattern 48. The through-hole is filled with a light-transmitting resin 49, and a third substrate 50 is stuck on an upper face of the second substrate 43. By forming a structure of side light-emitting type, the mounting substrate can be mounted in parallel with the light guiding plate without turning the substrate on its side. The shape of the light irradiating face can be determined by the shape of the through-hole, so that the shape of the light casting face can be made stable. In addition, the inner face of the through-groove is formed in a metallic through hole structure, light shielding and reflecting characteristics can be improved, and light directivity can be improved.
申请公布号 JP2001094157(A) 申请公布日期 2001.04.06
申请号 JP19990270243 申请日期 1999.09.24
申请人 SHARP CORP 发明人 KAMOSHITA SHOICHI
分类号 H01L33/54;H01L33/56;H01L33/60 主分类号 H01L33/54
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