SEMICONDUCTOR DEVICE PACKAGE WITH FOOTPRINT ALMOST SAME SIZE AS SEMICONDUCTOR DIE, AND MANUFACTURING PROCESS THEREFOR

摘要

PURPOSE: To provide a simple and low-cost manufacturing process by extending a metal layer from a protruding part of a conductive plate up to above a passivation layer along the side edge of a die while electrically insulated from a connection pad. CONSTITUTION: A metal layer 114 is formed over the rear side of a wafer, on which a metal plate 116 is fitted using a layer 115 comprising a conductive silver-filled epoxy or a conductive cement such as metal cement. The metal layer 114 is extended from the protruding part of the metal plate 116 up to over a passivation layer 104 along the side edge of a die. Due to the opening part of passivation layer 104, the metal layer 114 is electrically insulated from a gate connection pad 106G and source connection pads 105G and 106S.