摘要 |
PURPOSE: To obtain a pattern correcting device capable of correcting even a defect having a relatively large defective width. CONSTITUTION: This pattern correcting device comprises a paste application mechanism, a squeegee mechanism, an IR light source, a cutting laser part 2, a scratch mechanism, a vacuum function, and a semiconductor laser. A rib vacancy defect part 23 of a rib 22 is corrected as follows. The rib vacancy defect part 23 is protrusively applied with correction paste 24 by the paste application mechanism, an upper part of the rib 22 is shaped by the squeegee mechanism, the applied correction paste 24 is dried by the IR light source, the protrusion part of the correction paste 24 is cut by the cutting laser part 2, the protrusion part is removed by the scratch mechanism, the correction waste is sucked and removed by the vacuum function, then the rib 22 is baked by the semiconductor laser.
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