VACUUM CHUCK FOR PROCESS FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PURPOSE: A vacuum chuck for a process for manufacturing a semiconductor device is provided to reduce the quantity of particles adhered to a wafer, by remarkably reducing a contact area between the wafer and the vacuum chuck as compared with a conventional vacuum chuck. CONSTITUTION: A wafer absorbing unit(2) which is divided to a plurality of numbers, is installed on a body part(3) of a vacuum chuck(1). A vacuum groove(4) for inducing vacuum is installed in the center of the wafer absorbing unit. The wafer absorbing unit is an arc type and composed of a ceramic material.