METHOD FOR MANUFACTURING METAL WIRING AND WIRING BOARD PROVIDED WITH THE METAL WIRING

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a metal wiring manufactured at low cost, in which generation of a minute protrusion in the surface of base metal film is prevented, and moreover film-thickness can be made thin, and provide further a wiring board provided with the metal wiring. SOLUTION: A Ni film 2 is formed on an insulating substrate 1 by a DC magnetron sputter method. Then the Ni film 2 is patterned into a specified form. And an Au film 3 of superior corrosion resistance and low resistance is formed on the Ni film 12 of a patterning-formed wiring by an electroless plating. Further a low-cost Cu film 4 of low resistance is formed on the Au film 3 by an electrolytic plating.