| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure and a method for mounting a semiconductor device, with which cracks caused by stress due to the difference in the thermal expansion coefficients is prevented and a defective package can be exchanged easily for mounting. SOLUTION: Plural projection electrodes (solder bumps) 13 for external connection on an IC chip 12 are connected electrically with a circuit board 11 via a conduction pattern 141, terminal electrode 142, conduction pattern 151 and terminal electrode 152 of flexible first and second intermediate connecting layers 14 and 15. When the IC chip 12 is defective, the first intermediate connecting layer 14 with the terminal electrode part 142 mounting the IC chip 12 is cut as one block, together with a connecting area based on the terminal electrode part 142 of the second intermediate connecting layer 15, and the block of the first intermediate connecting layer 14 with the terminal electrode part 142 of a new nondefective article mounting the IC chip 12 is connected via the terminal electrode part 142 to the second intermediate connecting layer 15. |
