| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device, which is thinned using a stiffener in a novel structure for providing a thinned semiconductor device, and the production thereof having simplified processes. SOLUTION: A stiffener 9, composed of materials such as copper and stainless steel, is stuck on the other side of an insulating film, which is provided with an inner lead 4 and an external terminal 6 electrically connected thereto on one side and mounted with a semiconductor device 1 electrically connected with the inner lead, except for the region where the semiconductor device is mounted. An underfill resin seal 7 is interposed in a gap between the semiconductor device and the stiffener, and angular cutting or half etching is applied to at least one of upper and lower corner parts on the side of the stiffener which faces the semiconductor device. A potting process for forming the underfill resin seal and a soldering ball fitting process for the external terminal can be performed after the stiffener is stuck to the insulating film.</p> |
