发明名称 |
ELECTRONIC MODULE AND MANUFACTURING METHOD THEREOF |
摘要 |
PROBLEM TO BE SOLVED: To provide an electronic module having a low height and a cooled power. SOLUTION: This module is provided with a metal substrate, having one main surface which is insulated and supports an electrical connection track, and a constituent having at least one power provided with connection tabs 20 soldered to the track. The constituent having the power is fixed on a non- insulating surface. Furthermore the constituent is put in a housing which constitutes the inner wall of a cooling liquid circuit or is fixed to the housing. The tab of the constituent passes the substrate via a hole in the substrate. |
申请公布号 |
JP2001094024(A) |
申请公布日期 |
2001.04.06 |
申请号 |
JP20000252468 |
申请日期 |
2000.08.23 |
申请人 |
SOC APPL GEN ELECTR MEC <SAGEM> |
发明人 |
LE GOUIL JEAN-YVES |
分类号 |
H05K7/20;H01L23/14;H01L23/473;H05K1/02;H05K1/05;H05K3/34;(IPC1-7):H01L23/473 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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