发明名称 ELECTRONIC MODULE AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide an electronic module having a low height and a cooled power. SOLUTION: This module is provided with a metal substrate, having one main surface which is insulated and supports an electrical connection track, and a constituent having at least one power provided with connection tabs 20 soldered to the track. The constituent having the power is fixed on a non- insulating surface. Furthermore the constituent is put in a housing which constitutes the inner wall of a cooling liquid circuit or is fixed to the housing. The tab of the constituent passes the substrate via a hole in the substrate.
申请公布号 JP2001094024(A) 申请公布日期 2001.04.06
申请号 JP20000252468 申请日期 2000.08.23
申请人 SOC APPL GEN ELECTR MEC <SAGEM> 发明人 LE GOUIL JEAN-YVES
分类号 H05K7/20;H01L23/14;H01L23/473;H05K1/02;H05K1/05;H05K3/34;(IPC1-7):H01L23/473 主分类号 H05K7/20
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