SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME

摘要

PURPOSE: A substrate for a semiconductor package and a method for manufacturing the semiconductor package using the substrate are provided to minimize the warpage of the substrate and to simplify the removal of a cover lay tape. CONSTITUTION: The substrate(100) includes a resin layer in which a main-strip(4) is formed by a plurality of sub-strips arranged in a row and each sub-strip is formed by a plurality of through holes(8) arranged in a matrix form. An upper surface of the resin layer has conductive circuit patterns including bond fingers and ball lands formed around the through holes(8). The resin layer and the circuit patterns are covered with a cover coat except the bond fingers and the ball lands. In addition, the cover lay tape(30) is attached to a lower surface of the resin layer to cover the through holes(8). Particularly, the cover lay tape(30) has a plurality of cutting lines(32) each formed on a boundary between the adjacent sub-strips. Due to the cutting lines(32), the substrate(100) can be prevented from the warpage and the cover layer tape(30) can be easily removed.