| 摘要 |
PURPOSE: Equipment for solder ball mounting is provided to prevent defect of solder ball mounting previously, to maintain the quality of semiconductor package over a fixed level, and to make the semiconductor package as small as possible by minimizing pitch length between solder balls. CONSTITUTION: A substrate(1), after finishing pre-work steps such as a semiconductor chip attaching step, or a molding process, is loaded on a loading magazine(10), and the loading magazine(10) is transferred on a loading stage(11) in a solder ball mounting equipment(100). The substrate(1) is released from the loading magazine(10), and moved on a transfer guide(20). The transfer guide(20) carries the substrate(1) on a lower part of solder ball stencil tool(30). Following a guide line(35), a supply frame of solder solution(36) is transported in front of a mask plate(31), and solder solution is erupted to the mask plate(31). A rotating roller(33) is shifted through the guide line(35), and rapid rolling process is operated with contacting to the mask plate(31). The solder solution on the mask plate(31) is passed through stencil apertures(31a), and same site of solder balls is formed on the substrate(1) I/O(Input/Output) terminal part. After making the solder balls, the substrate(1) in the transfer guide is moved into melting chamber(60), and the solder ball are reflowed. Completing the reflowing process, the substrate(1) is loaded in a loading magazine(70) and transferred to the next steps like a singulation step.
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