发明名称 METHOD OF FORMING EXPOSED CIRCUIT PATTERNS OF PRINTED CIRCUIT BOARD(PCB)
摘要 PURPOSE: A method of forming exposed circuit patterns of a printed circuit board(PCB) is provided to simplify the forming operation and increase the precision simultaneously and enable an integrated or small PCB. CONSTITUTION: In a method of forming exposed circuit patterns, circuit patterns are formed on a board(21). Solder resist(25) is applied on a board(21) formed with circuit patterns(22). The solder resist(25) is hardened as insulation. Certain parts of the solder resist(25) are eliminated selectively by laser(L) projected until the circuit patterns are exposed, accomplishing a solder land(30). Here, corresponding to the shape of the exposed spot, differently shaped lasers such as circular and rectangular lasers are used. And when the single laser(L) beam cannot be exposed the whole part, exposition is completed by moving the laser(L) inside the exposed area.
申请公布号 KR20010028723(A) 申请公布日期 2001.04.06
申请号 KR19990041107 申请日期 1999.09.22
申请人 LG ELECTRONICS INC. 发明人 JANG, YONG SUN;JIN, WON HYEOK;LEE, SEONG GYU
分类号 H05K3/02;(IPC1-7):H05K3/02 主分类号 H05K3/02
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