| 摘要 |
PURPOSE: A pin grid array package using a thermal pad is provided to simplify a manufacturing process, by simply using tightening force of a bolt while using the thermal pad which has fluidity at a room temperature. CONSTITUTION: A chip mount area(132) is formed in the center of an upper surface of a substrate(130) for a pin grid array. A plurality of pins for external connection have a lattice type arrangement, installed along an outer wall of a lower surface. The chip mount area is electrically connected to the pins. A semiconductor chip(110) is flip-bonded by intervening solder balls(120) on the chip mount area. A supporting unit(160) of a predetermined height is formed along an outer wall of the upper surface of the substrate. A metal lid(140) covers the flip-bonding portion, fixed in the supporting unit. A thermal pad(150) is inserted into a gap between the semiconductor chip and the metal lid. The metal lid is fixed in the supporting unit through a bolt(170), and the thermal pad is physically pressured by tightening force of the bolt.
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