| 摘要 |
PROBLEM TO BE SOLVED: To simplify manufacturing processes and improve an alignment accuracy for an internal and an external layer of a multilayer wiring board. SOLUTION: The manufacturing equipment of a multilayer wiring board wherein a photo mask 20 formed with an original drawing of a circuit pattern, and a multilayer wiring board 31 provided with a photosensitive external layer 33 and formed with an internal layer target mark 32 are closely adhered to each other to form the circuit pattern on the external layer 33. The photo mask 20 is formed with a mask-side target mark 21 corresponding to the internal layer target mark 32, and see-through means (15, 16, 17) which simultaneously detects the internal layer target mark 32 and the mask-side target mark 22 is installed. Based on the output of the see-through means, the photo mask 20 and the multilayer wiring board 31 are aligned with each other. |
