MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board having a solder resist layer in which signal delay and a signal error are hard to occur even if a high- frequency signal in a GHz band is used. SOLUTION: In a multilayer printed wiring board in which a conductor circuit and a resin insulating layer are formed in this order on a board, and a solder resist layer is formed in the uppermost layer, an electrical loss tangent of the solder resist layer is 0.01 or below in 1 GHz.