发明名称 HEAT SEALED CONNECTOR AND CONNECTION STRUCTURE USING SAME
摘要 PROBLEM TO BE SOLVED: To provide a heat sealed connector at low cost, maintaining high connection reliability even in a narrow pitch connection. SOLUTION: A circuit board, which consists of a flexible substrate 2 with tension resiliency Eb and thickness Tb, and a circuit pattern 3 with tension resiliency Ec and thickness Tc formed on at least one surface of the flexible substrate 2, is provided with a heat sealed connector, which includes an anisotropic electrical contact agent 6 consisting of an insulating adhesive 5 with tension resiliency Ea, thickness Ta and volume Va, and conductive particles 4 with compression resiliency Ep average particle size and volume Vp, which meets the formula below. The above heat sealed connector is used for connecting the electrodes. Eb×Tb+Ec×Tc<(Ep/ϕ)×[Vp/(Va+Vp)]<(Ea/ Ta)×[Va/(Va+Vp)].
申请公布号 JP2001093600(A) 申请公布日期 2001.04.06
申请号 JP19990270920 申请日期 1999.09.24
申请人 SHIN ETSU POLYMER CO LTD 发明人 YOSHIDA KAZUYOSHI;ODAJIMA SATOSHI
分类号 H01R11/01;G02F1/1345;H01B1/20;H01B5/16;(IPC1-7):H01R11/01;G02F1/134 主分类号 H01R11/01
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