PROCESSING CHAMBER FOR FABRICATION OF SEMICONDUCTOR DEVICE

摘要

PURPOSE: A processing chamber for fabrication of a semiconductor device is provided to prevent the occurrence of particles by lifting of a layer deposited on a cover ring surrounding a wafer. CONSTITUTION: The wafer(29) is loaded onto a susceptor(28) centrally located in the processing chamber(21). The cover ring disposed around the wafer(29) is divided into inner and outer cover rings(40,50), and a focus ring(30) is interposed between the susceptor(28) and the inner cover ring(40). The focus ring(30) is made of silicon carbide similar to wafer material, and further, the cover rings(40,50) are made of silicon. In addition, the inner cover ring(40) has an integrated form. Therefore, the deposited layer on the cover rings(40,50) can be prevented from being lifting due to a shake of the cover rings(40,50) or a difference in coefficient of thermal expansion.