| 摘要 |
PURPOSE: An integrated type heat sink for several memory modules is provided to enable an efficient dissipation of heat generated from the modules. CONSTITUTION: The heat sink(10) includes a plurality of heat-dissipating members(20) for dissipating heat generated from the modules and a plurality of fixing members(30) for fixing the heat-dissipating members(20). All the members(20,30) are integrated into the single heat sink(10). Each memory module has a plurality of BGA packages mounted on both sides of a PCB. A top surface of each package is fixedly attached to an inner wall of the heat-dissipating member(20) by an adhesive. A lower portion of each PCB is inserted into a groove(4a) of a socket(4). Each heat-dissipating member(20) is composed of the first and the second module contact parts(21,22) facing each other and connected at upper ends thereof by an upper connecting part(23). Each fixing member(30) is composed of a lower connecting part(31) for connecting the first and the second module contact parts(21,22) at lower ends thereof, and a downward extended part(32) inserted into a groove(4b) of the socket(4).
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