AN ARRAY OF CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER ELEMENTS WITH THROUGH WAFER VIA CONNECTIONS

摘要

There is described a cMUT array with transducer elements which include a plurality of cells with membranes (26) formed on one surface of a wafer (14). Voltages applied between said spaced electrodes drive said membranes. The voltages applied to said electrodes are applied from the opposite surface of the wafer (14) through the wafer and through vias (16) formed in the wafer.