| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component superior in productivity which can easily keep an extremely small chip component and can form electrodes on both end faces of this chip. SOLUTION: This manufacturing method forms electrodes at both opposed end faces of chip parts 1 by inserting the chip parts 1 into the through holes 4 of a first pallet 3 where a plurality of through holes 4 are made and an adhesive sheet 7 is stuck to the bottom, and forming electrodes 2 at the other end faces of the chip parts 1 which are retained and projected, with one end face each of the chip parts 1 stuck to the first adhesive sheet 7, and transferring the chip parts 1 to a second pallet 15, where a plurality of through-holes 16 are formed and an adhesive sheet 19 is stuck to the bottom thus forming electrodes on one face each of the chip parts 1, and then separating the chip parts 1 from the second pallet 15.</p> |
