发明名称 |
ELECTRONIC DEVICE AND METHOD OF MANUFACTURE THEREOF |
摘要 |
An electronic device comprises a case with steps on its inner wall, in which components are accurately mounted in place. A package (13) has an inner wall with steps (26), on which inner connection electrodes (14) are formed. The bottom of the package (13) is provided with a shield electrode (15), on which a component (17) is fixed with an adhesive layer (16). The component (17) and the inner connection electrodes (14) are connected through wires (19) electrically. Any of the component (17) and the wire (19) is positioned and fixed a predetermined position with respect to areas (18a, 18b) on the bottom of the package (13) where no electrode exists. |
申请公布号 |
WO0124252(A1) |
申请公布日期 |
2001.04.05 |
申请号 |
WO2000JP06646 |
申请日期 |
2000.09.27 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;MURAKAMI, KOZO;FUJII, KUNIHIRO;MATSUO, SATOSHI |
发明人 |
MURAKAMI, KOZO;FUJII, KUNIHIRO;MATSUO, SATOSHI |
分类号 |
H01L21/50;H01L21/60;H01L23/057;H01L23/13;H01L23/552;H03H9/25 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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