| 发明名称 |
Process for protecting a printed circuit board comprises preparing a protecting composition based on a thermoplastic resin, melting the composition by heating, and applying the composition to the board |
| 摘要 |
Process for protecting a printed circuit board comprises preparing a protecting composition based on a thermoplastic resin; melting the composition by heating; and applying the composition to the board.
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| 申请公布号 |
DE10030757(A1) |
申请公布日期 |
2001.04.05 |
| 申请号 |
DE20001030757 |
申请日期 |
2000.06.23 |
| 申请人 |
MEC CO., LTD. |
发明人 |
KAWANABE, YUTAKA;MAWATWRI, TOYOKI;TOJIMA, HIROYOSHI;SAKAMOTO, YOSHIRO;YONEOKA, TSUYOSHI;AKIYAMA, DAISAKU |
| 分类号 |
B05C1/02;B05D1/02;B05D1/28;B05D7/00;B05D7/22;B05D7/24;H05K3/28;H05K3/34;(IPC1-7):H05K3/28;H05K1/03 |
主分类号 |
B05C1/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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