POLISHING PAD TREATMENT FOR SURFACE CONDITIONING

摘要

A polishing pad is treated for surface conditioning by exposing a polishing surface on the pad to a chemical solvent having a solubility parameter that differs by less than about twenty percent from a solubility parameter of the material of the polishing pad that provides the polishing surface, wherein the polishing surface is softened relative to a remainder of the material to minimize the time consumed by surface conditioning of the polishing surface.