| 摘要 |
The present invention is a method for coupling substrates (11, 21) together. Two clean substrates (11, 21) are bonded together along their peripheral edges (15), and then positioned at approximately a 10-70 degree angle (or range therebetween) parallel to each other and in close proximity to each other. An optically clear, refractive index means for coupling (23) is then de-gassed to remove any gas. Then, a pressurized means (25) for injecting is filled with the means for coupling (23). The means for injecting (25) then introduces the means for coupling (23) within the two substrates (11, 21) from a peripheral edge, thereby allowing the means for coupling (23) to permeate throughout the volume between the two substrates (11, 21). The means for coupling (23) is allowed to cure, thereby adhering the substrates (11, 12) together. |
