发明名称 SHEET-LIKE CONNECTOR, MANUFACTURING METHOD THEREOF, SEMICONDUCTOR DEVICE CONNECTING APPARATUS AND INSPECTING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a sheet-like connector, manufacturing method thereof, a semiconductor device connecting apparatus and an inspecting apparatus whereby a satisfactory electric connecting condition is surely attained, even when the pressing load on a semiconductor device to be electrically connected is low. SOLUTION: The sheet-like connector comprises through-conductive parts at positions on an insulative sheet, corresponding to projecting electrodes formed on a semiconductor device formed on the top surface of the insulative sheet. the through-conductive parts pierce in the thickness direction of the insulative sheet, protrudent conductive parts protruding upward are formed at peripheral parts of the top faces of the through-conductive parts continuously together with the through-conductive parts and if the projecting electrodes of the semiconductor device have each a semispherical shape, the protrudent conductive parts are formed such that the top faces of the through-conductive parts and a part of the protrudent conductive parts contact the semispherical surfaces at the same time.
申请公布号 JP2001091579(A) 申请公布日期 2001.04.06
申请号 JP19990270578 申请日期 1999.09.24
申请人 JSR CORP 发明人 IGARASHI HISAO;HIRASAWA HIROYUKI;KOKUBO TERUKAZU
分类号 H01R11/01;G01R1/073;G01R31/26;H01R43/00;(IPC1-7):G01R31/26 主分类号 H01R11/01
代理机构 代理人
主权项
地址