Semiconductor component used in e.g. mobile phone, mobile information unit, has intermediate connection which couples electrodes on semiconductor component to connection electrodes of resin component

摘要

Number of electrodes (2) are arranged on a semiconductor chip (1). A resin component (5) with the connection electrodes is provided and separated from the electrodes on the semiconductor chip. The electrodes on the semiconductor chip are connected to the connection electrodes of the resin component via an intermediate connection (6). An Independent claim is also included for a semiconductor component manufacturing method.