发明名称 ROTATING MAGNET ARRAY AND SPUTTER SOURCE
摘要 <p>A sputtering system and magnet array for depositing metal and metal-reactive gas coatings onto a substrate is designed for use in a rotating magnetron. The magnet array (100) includes a plurality of magnets disposed on a plate. The plurality of magnets is arranged such that a closed-loop magnetic path (112) is formed. The shape of the magnetic path is a double-lobe structure that includes first and second lobes that are symmetric to one another about an axis in the plane of the plate that intersects the center of rotation of the plate. The magnets are arranged in several rows. A first row of magnets has a double-lobe structure that corresponds to the first and second lobes (106, 107) of the magnetic path. Second and third rows (108, 110) of magnets are arranged in the shape of rings inside the first and second lobes (106, 107) of the magnetic path. The lobe structure of the magnetic path can be circular or elliptical in shape.</p>
申请公布号 WO2001023634(A1) 申请公布日期 2001.04.05
申请号 US2000026503 申请日期 2000.09.27
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