SEMICONDUCTOR CUTTING DEVICE

摘要

PURPOSE:To three-dimensionally grasp the state of an inner peripheral edge at the time of the cutting of an ingot and the cut cross-sectional shape of the cut ingot. CONSTITUTION:Displacement sensors 10, 12, 14 measuring the displacement of an inner peripheral edge 6 in the thickness direction thereof are provided at the position opposed to the inner peripheral edge 6 along the peripheral direction of the inner peripheral edge 6 so as to hold a work (ingot) 8 during cutting between the edge 6 and the sensors.