COMPOSITIONS FOR AND METHODS OF REDUCING/ELIMINATING SCRATCHES AND DEFECTS IN SILICON DIOXIDE CMP PROCESS

摘要

An aqueous slurry-less composition for chemical-mechanical-polishing of a silicon dioxide workpiece comprising: a cationic surfactant that is soluble and ionized at neutral to alkaline pH conditions, in which the cationic surfactant is present in an aqueous slurry-less composition in an amount less than its critical micelle concentration.