WAFER GRINDER

摘要

A wafer grinder is provided with a retainer ring unlikely to damage a wafer. In the wafer grinder, a wafer (54) is ground with a layer of compressed air formed between a career (24) and the wafer (54), and a retainer ring (30) for preventing the wafer (54) from leaving the career (24) is formed such that it elastically deforms to meet the border of the wafer (54) when pressed by the wafer (54). Since the wafer (54) is urged in contact with the retainer ring (30) during grinding, the pressure acting on the wafer (54) from the retainer ring (30) is distributed so that the wafer (54) may not suffer damage.