Carrier for an integrated circuit module handler

摘要

A chamber for a module IC handler is disclosed which consists of a pre-heater for suitably heating a carrier containing a plurality of module IC at a preset temperature (which may be generated at the driving of the module IC) before the tests for the module IC are performed, and a test site for performing the tests with a external tester while pushing the carrier by using the pusher. The chamber consists of: a seating piece on which plural seating grooves are formed that place the carrier containing the module ICs thereon; a driving piece which is retractable and movable upward/downward, and on which a seating groove having the same spacing as that of the seating groove formed in the seating piece is formed; driving piece ascending/descending means for elevating/lowering the driving piece above a top surface of the seating piece relative to a top surface of the driving piece; driving piece advancing/retracting means for advancing/retracing the driving piece by one pitch corresponding to a spacing between the seating grooves formed in the seating piece; and transferring means for holding and transferring the carrier, which has the module IC heated in accordance with the tests conditions, positioned on a transfer path of the test site toward the test site.