Porous dielectric materials having low dielectric constants useful in electronic component manufacture are disclosed along with methods of preparing the porous dielectric materials. Also disclosed are methods of forming integrated circuits containing such porous dielectric materials.
申请公布号
EP1088848(A1)
申请公布日期
2001.04.04
申请号
EP20000308660
申请日期
2000.10.02
申请人
SHIPLEY COMPANY LLC
发明人
ALLEN, CRAIG S.;ANNAN, NIKOL;BLANKENSHIP, ROBERT M.;GALLAGHER, MICHAEL K.;GORE, ROBERT H.;LAMOLA, ANGELO A.;YOU, YUJIAN
