发明名称 Wiring substrate method of producing the same and electronic device using the same
摘要 A ceramic multi-layer wiring substrate includes a line-shaped insulation pattern arranged to extend over a plurality of surface wiring patterns and to intersect the respective surface wiring patterns, in which soldering land electrodes are defined by the insulation patterns.
申请公布号 GB0104068(D0) 申请公布日期 2001.04.04
申请号 GB20010004068 申请日期 2001.02.19
申请人 MURATA MANUFACTURING CO. LTD. 发明人
分类号 H01L21/60;H01L23/498;H05K1/03;H05K3/34;H05K3/46 主分类号 H01L21/60
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