发明名称 |
Wiring substrate method of producing the same and electronic device using the same |
摘要 |
A ceramic multi-layer wiring substrate includes a line-shaped insulation pattern arranged to extend over a plurality of surface wiring patterns and to intersect the respective surface wiring patterns, in which soldering land electrodes are defined by the insulation patterns. |
申请公布号 |
GB0104068(D0) |
申请公布日期 |
2001.04.04 |
申请号 |
GB20010004068 |
申请日期 |
2001.02.19 |
申请人 |
MURATA MANUFACTURING CO. LTD. |
发明人 |
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分类号 |
H01L21/60;H01L23/498;H05K1/03;H05K3/34;H05K3/46 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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