发明名称 Insulating thick film composition ceramic electronic device using the same and electronic apparatus
摘要 <p>An insulating thick film composition for forming a solder resist layer having a high degree of positional accuracy is provided, which can suppress warping and undulation of a multilayer ceramic substrate and can maintain the superior electrical characteristics thereof. The insulating thick film composition is primarily composed of a powdered ceramic having the same composition system as that of a powdered ceramic contained in a green ceramic sheet, and the mean particle diameter of the powdered ceramic of the insulating thick film composition is smaller than that of the powdered ceramic contained in the green ceramic body.</p>
申请公布号 GB0104065(D0) 申请公布日期 2001.04.04
申请号 GB20010004065 申请日期 2001.02.19
申请人 MURATA MANUFACTURING CO. LTD. 发明人
分类号 C04B35/00;C04B35/195;H01L23/15;H01P3/02;H05K1/03;H05K3/34;H05K3/46 主分类号 C04B35/00
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