Opto-electronic hybrid integration platform, optical sub-module, opto-electronic hybrid integration circuit, and process for fabricating platform

摘要

An opto-electronic hybrid integrated circuit, characterized by comprising an opto-electronic hybrid platform, said platform including an optical waveguide including an under-clad, a core, and an over-clad; a silicon terrace, a dielectric layer, and a conductor pattern provided inside or on the surface of said dielectric layer; thickness of said dielectric layer being set so that height of said conductor pattern is substantially equal to a height of said optical waveguide over-clad surface; a carrier having an optical device holding surface for holding an optical device, a carrier height reference surface located at a predetermined distance from said optical device holding surface, and a carrier electrical wiring; and an optical device held on said optical device holding surface; wherein a height from said optical functional device active layer to said carrier height reference surface is set nearly equal to a step between said optical waveguide core and said silicon terrace upper surface; said carrier electrical wiring and an active layer side electrode of said optical functional device are electrically connected forming an optical sub-module; a silicon terrace of said opto-electronic hybrid packaged substrate and said carrier height reference surface of said optical device sub-module contact, and said conductor pattern on said dielectric layer of said opto-electronic hybrid packaged substrate and said carrier electrical wiring of said optical sub-module are electrically connected.