发明名称 Adhesive film, useful for the absorption of sound and vibration from a cutting or grinding device, comprises a denatured epoxy resin and/or rubber and noise and vibration absorbing material.
摘要 An adhesive film (I) for the absorption of sound and vibration by bonding the components of a cutting or grinding device that produces sound and vibration is claimed. The film (I) comprises (A) a denatured epoxy resin and/or rubber that is semi-hardened and containing (B) noise and vibration absorbing material. Independent claims are included for: (i) a process for the production of the adhesive film (I) by impregnating sound and vibration absorbing material (B) with the resin (A), drying and semi-hardening; (ii) a saw blade, (II) comprising a disk body of at least two disk parts for connection to the screw of an electric motor and at least one adhesive film (I) arranged between the disk parts; and (iii) a process for the production of a saw blade (II) by applying an adhesive film (I) between at least two disk parts of a disk body.
申请公布号 DE19959347(A1) 申请公布日期 2001.04.05
申请号 DE19991059347 申请日期 1999.12.09
申请人 EHWA DIAMOND IND. CO., LTD. 发明人 LEE, CHANG HYUN;CHOI, HYUN SEOK
分类号 B24D5/00;B23D61/02;B23D65/00;B24D5/12;B28D7/00;C09J7/02;C09J7/04;C09J121/00;C09J161/06;C09J163/00;F16F7/00;F16F15/02;(IPC1-7):C09J7/04 主分类号 B24D5/00
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