SEMICONDUCTOR LASER MODULE

摘要

A laser diode module is provided which is capable of suppressing reduction in the efficiency of laser beam coupling with an optical fiber even in the case where a warp is caused in the mounting surface of a temperature control device on which a laser, diode chip is mounted. A laser diode module (1) has a heat transferring member (5) and optical coupling portion (7a) mounted directly or indirectly on a mounting surface (3a) of a temperature control device (3). A laser diode chip (6) and the optical coupling portion (7a) are located on the same side of the mounting surface along the emitting direction of a laser beam emitted from the laser diode chip, with respect to a first center line (Lcpp) intersecting perpendicularly with a tangential plane tangent to the mounting surface (3a) of the temperature control device (3) at the center thereof and/or a second center line passing through the center of the mounting surface of the temperature control device and perpendicular to both the first center line and an axis representative of the emitting direction of the laser beam.