发明名称 |
Formulations including a 1, 3-dicarbonyl compound chelating agent for stripping residues from semiconductor substrates |
摘要 |
A semiconductor wafer cleaning formulation for use in post plasma ashing semiconductor fabrication comprising the following components in the percentage by weight ranges shown: an organic amine 2-98%; water 0-50%; a 1,3-dicarbonyl compound chelating agent 0.1-60%; a second or alternative chelating agent 0-25%; a polar organic solvent 2-98%.
|
申请公布号 |
US6211126(B1) |
申请公布日期 |
2001.04.03 |
申请号 |
US19990331537 |
申请日期 |
1999.08.20 |
申请人 |
ADVANCED TECHNOLOGY MATERIALS, INC. |
发明人 |
WOJTCZAK WILLIAM A.;GUAN GEORGE;FINE STEPHEN A. |
分类号 |
C11D3/20;C11D7/26;C11D7/32;C11D7/34;C11D7/50;C11D11/00;C23G5/02;G03F7/42;H01L21/02;H01L21/311;H01L21/3213;(IPC1-7):C11D9/04;B08B6/00;C03C23/00 |
主分类号 |
C11D3/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|