PHASE CHANGE HEAT TRANSFER MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide a heat transfer material (A) for transferring heat from a heat source (12), such as a microprocessor, to a heat sink (14). SOLUTION: This transfer material comprises a heat-conductive filler dispersed in a phase change material. The phase change material is melted and fluidized at the operation temperature of a heat source, thereby well thermally bringing the non-smooth heat source into contact with the surface of a heat sink, and the transfer material is excessively not oozed or lost. The phase change material comprises a polymer, such as an elastomer, and a melting point component. The melting point material controls the softening point of the phase charge material to the operation temperature of the heat source.