发明名称 Method for fabricating a metal-oxide semiconductor transistor
摘要 A method for fabricating a metal-oxide semiconductor (MOS) transistor. A substrate having a gate structure is provided. The method of the invention includes forming a liner spacer on each side of the gate structure and a low dopant density region deep inside the substrate. The low dopant density region has a lower dopant density than that of a lightly doped region of the MOS transistor. Then a interchangeable source/drain region with a lightly doped drain (LDD) structure and an anti-punch-through region is formed on each side of the gate structure in the low dopant density region. The depth of the interchangeable source/drain region is not necessary to be shallow.
申请公布号 US6211023(B1) 申请公布日期 2001.04.03
申请号 US19980191202 申请日期 1998.11.12
申请人 UNITED MICROELECTRONICS CORP. 发明人 YEH WEN-KUAN;CHOU JIH-WEN
分类号 H01L21/336;H01L29/10;H01L29/78;(IPC1-7):H01C21/336 主分类号 H01L21/336
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