发明名称 PLATING METHOD AND PLATING DEVICE USING INSOLUBLE ANODE
摘要 PROBLEM TO BE SOLVED: To provide a plating method and a device therefor using an insoluble anode executing the supply only of metallic ions to be insufficient to a plating solution and preventing the accumulation of the other ions in the plating solution. SOLUTION: As to this method and device, separately from a plating tank 10, an electrolytic cell 11 in which plating metal is dissolved and the generation only of cations is executed, is provided, and, the supply of cations to be insufficient is executed from the electrolytic cell 11 to the plating tank 10.
申请公布号 JP2001089900(A) 申请公布日期 2001.04.03
申请号 JP19990265318 申请日期 1999.09.20
申请人 SHIMONOSEKI MEKKI KK 发明人 YOKOCHI MASAO;HIRAYAMA YOJI;MATSUNAGA SHIGEHARU
分类号 C25D21/14;C25D21/16;C25D21/22;(IPC1-7):C25D21/14 主分类号 C25D21/14
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