发明名称 |
Epoxy resin composition, laminate film using the same, and semiconductor device |
摘要 |
An epoxy resin composition comprising an epoxy resin containing 0-10% by weight of a 2-nucleus compound and 50-100% by weight of 3 to 5-nucleus compounds combined and having a dispersity (Mw/Mn) of 1.0-1.7, an inorganic filler, a curing catalyst, and optionally a phenolic resin, and having a Tg of lower than 15° C. in an uncured state is effective in forming a flexible film which is easy to work at room temperature. A laminate film includes a layer of the epoxy resin composition and a protective layer. By sealing a semiconductor chip with the film, there is obtained a semiconductor package having improved heat resistance, improved moisture resistance, low stress property.
|
申请公布号 |
US6210811(B1) |
申请公布日期 |
2001.04.03 |
申请号 |
US19990404301 |
申请日期 |
1999.09.24 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
HONDA TSUYOSHI;WAKAO MIYUKI;SHIMIZU HISASHI;SHIOBARA TOSHIO |
分类号 |
C08G59/32;C08K3/00;C08L63/00;H01L21/56;H01L23/29;(IPC1-7):H01L29/12 |
主分类号 |
C08G59/32 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|