发明名称 |
Printed circuit board and method of manufacturing the same |
摘要 |
A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.
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申请公布号 |
US6211487(B1) |
申请公布日期 |
2001.04.03 |
申请号 |
US19990379008 |
申请日期 |
1999.08.23 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
HATAKEYAMA AKIHITO;NAKATANI SEIICHI;KAWAKITA KOUJI;SOGOU HIROSHI;OGAWA TATSUO;KOJIMA TAMAO |
分类号 |
H05K1/03;H05K3/40;H05K3/46;(IPC1-7):H05K3/36 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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