发明名称 Printed circuit board and method of manufacturing the same
摘要 A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.
申请公布号 US6211487(B1) 申请公布日期 2001.04.03
申请号 US19990379008 申请日期 1999.08.23
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 HATAKEYAMA AKIHITO;NAKATANI SEIICHI;KAWAKITA KOUJI;SOGOU HIROSHI;OGAWA TATSUO;KOJIMA TAMAO
分类号 H05K1/03;H05K3/40;H05K3/46;(IPC1-7):H05K3/36 主分类号 H05K1/03
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