| 摘要 |
A process including providing a hollow cvlindrical substrate, the substrate having a dry outer surface describing a curvilinear plane, a dry inner surface describing a curvilinear plane, a first end opposite a second end, and an imaginary axis extending from the first end to the second end, supporting the substrate, machining at least a portion of at least one end of the substrate with at least one dry polycrystalline diamond cutting tool in the absence of liquids to remove material from the substrate, and simultaneously maintaining, during machining, the dry inner surface of the cylindrical substrate free of the material machined from the at least one end of the substrate by the at least one dry polycrystalline diamond cutting tool.
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