发明名称 BOBBINLESS COIL OF SOLDER WIRE
摘要 PROBLEM TO BE SOLVED: To provide a bobbinless coil of a solder wire which a user need not dispose of an empty bobbin wherein the coil is free from deformation of the coil or disturbance on a surface which interferes when the user draws the solder wire from the interior and a type or the like of the bobbinless coil can be easily identified any time. SOLUTION: The bobbinless coil of a solder wire comprises a hollow cylindrical body 2 with the solder wire 3 wound around in a neatly dense manner. An initial end of the solder wire is placed on one of end surfaces of the body 2, while a paper disk 5 with an outer diameter equal to or slightly smaller than that of the body is brought into contact with the other end surface. A heat-shrinkable film 6 is used to cover and fasten the body 2 except a hollow portion on one of the end surfaces, an outer peripheral surface of the body 2 and an outer peripheral portion of the paper disk 5, thereby providing the bobbinless coil 1 of the solder wire.
申请公布号 JP2001088882(A) 申请公布日期 2001.04.03
申请号 JP19990269218 申请日期 1999.09.22
申请人 MATSUO HANDA CO LTD 发明人 TAKAOKA YOJIRO
分类号 B65D85/04;B23K3/06;(IPC1-7):B65D85/04 主分类号 B65D85/04
代理机构 代理人
主权项
地址