发明名称 Method for fabricating solid state image sensor
摘要 Method for fabricating a solid state image sensor, which can improve a charge transfer efficiency of an end terminal, including the steps of (1) providing a first conduction type substrate having a second conduction type well and a BCCD formed therein for an end terminal, (2) continuously increasing impurity concentrations in a region of the substrate in which a floating diffusion region is to be formed and in a portion of an area of other substrate in which the regions are are to be formed for improving a horizontal charge transfer efficiency, and (3) forming transfer gates, an output gate, and reset gate on the substrate, and the floating diffusion region and a reset drain region in the BCCD, respectively.
申请公布号 US6210990(B1) 申请公布日期 2001.04.03
申请号 US19990350086 申请日期 1999.07.09
申请人 LG SEMICON CO., LTD. 发明人 KWON KYOUNG KUK
分类号 H01L27/148;H04N5/335;H04N5/357;H04N5/372;(IPC1-7):H01L21/00 主分类号 H01L27/148
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