发明名称 Plasma processing equipment
摘要 A plurality of extracting orifices 42 for extracting the electron beam from a discharge portion 2 into a plasma process chamber 3 via a compartment 4 are provided radially. A plurality of accelerating electrodes 36, 37 are arranged in the process chamber 3. The electron extracting direction from the extracting orifices 42 is set in substantially parallel with an object surface 35. The number and the arrangement of the accelerating electrodes 36, 37 are set such that a density distribution of the excited plasma has an oprimal state for processing the object. The object having a large area can be processed appropriately.
申请公布号 US6211622(B1) 申请公布日期 2001.04.03
申请号 US19990435768 申请日期 1999.11.08
申请人 KAWASAKI JUKOGYO KABUSHIKI KAISHA 发明人 RYOJI MAKOTO;HASEGAWA TAKESHI;BAN MASAHITO;MORI YUKITAKA
分类号 H05H1/24;H01J37/32;(IPC1-7):H01J27/02 主分类号 H05H1/24
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